Advanced Thermal Management Materials
(Sprache: Englisch)
This book offers a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. Covers all aspects of thermal management materials, both traditional and non-traditional, with an emphasis on metal based materials.
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This book offers a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. Covers all aspects of thermal management materials, both traditional and non-traditional, with an emphasis on metal based materials.
Klappentext zu „Advanced Thermal Management Materials “
Advanced Thermal Management Materials provides a comprehensive and hands-on treatise on the importance of thermal packaging in high performance systems. These systems, ranging from active electronically-scanned radar arrays to web servers, require components that can dissipate heat efficiently. This requires materials capable of dissipating heat and maintaining compatibility with the packaging and dye. Coverage includes all aspects of thermal management materials, both traditional and non-traditional,with an emphasis on metal based materials. An in-depth discussion of properties and manufacturing processes, and current applications are provided. Also presented are a discussion of the importance of cost, performance and reliability issues when making implementation decisions, product life cycle developments, lessons learned and future directions.
Inhaltsverzeichnis zu „Advanced Thermal Management Materials “
Introduction to Thermal Management in Microelectronics Packaging.- Requirements of Thermal Management Materials.- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials.- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies.- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications.- Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications.- Al/SiC Thermal Management Materials.- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper.- Future Trend of Advanced Thermal Management Materials.
Bibliographische Angaben
- Autoren: Guosheng Jiang , Liyong Diao , Ken Kuang
- 2014, 2013, XII, 156 Seiten, Maße: 15,5 x 23,5 cm, Kartoniert (TB), Englisch
- Verlag: Springer, Berlin
- ISBN-10: 1489992545
- ISBN-13: 9781489992543
Sprache:
Englisch
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