Assembly and Reliability of Lead-Free Solder Joints

Solder Joints in Printed Circuit Board Assembly.- Solder Joints in Advanced Packaging.- Prevailing Lead-Free Materials.- Soldering Processes.- Advanced Specialty Flux Design.- Solder Joint Characterization.- Reliability Tests and Data Analyses of Solder Joints.- Design for Reliability and Failure Analysis of Solder Joints.

John H. Lau, Ph.D., P.E. has been the CTO of Unimicron in Taiwan since August 2019. Prior to that, he was a Senior Technical Advisor at ASM Pacific Technology in Hong Kong for 5 years; a specialist of the Industrial Technology Research Institute in Taiwan for 4½ years and a Senior Scientist/MTS at Hewlett-Packard Laboratory/Agilent in California for more than 25 years. He earrned a Ph.D. degree in theoretical and applied mechanics from the University of Illinois at Urbana-Champaign.

With more than 40 years of R&D and manufacturing experience, he has authored or coauthored more than 480 peer-reviewed technical publications, invented more than 30 issued or pending US patents, and given more than 300 lectures/workshops/keynotes worldwide. He has authored or coauthored 20 textbooks on fan-out wafer-level packaging, 3D IC heterogeneous integration and packaging, TSV for 3D integration, advanced MEMS packaging, reliability of 2D and 3D IC interconnects, flip chip, WLP, MCM, area-array packages, WLCSP, high-density PCB, SMT, DCA, TAB, lead-free materials, soldering, manufacturing, and solder joint reliability.

He has received many awards from the American Society of Mechanical Engineers (ASME), the Institute of Electrical and Electronics Engineers (IEEE), the Society of Manufacturing Engineers (SME) and other societies. He is an elected ASME fellow, IEEE fellow, and IMAPS fellow, and has been heavily involved in many of ASME's, IEEE's, and IMAPS' technical activities.




Ning-Cheng Lee is the Vice President of Technology of Indium Corporation. He has been with Indium since 1986. Prior to joining Indium, he was with Morton Chemical and SCM. He has more than 30 years of experience in the development solder materials for SMT industries. In addition, he also has very extensive experience in the development of underfills and adhesives. He received his PhD in polymer science from University of Akron in 1981.

Ning-Cheng has

"The book gives a wide perspective on the technical insights of lead-free solder joint reliability and packaging approaches in the industry while adding very valuable solder joint reliability insights. It is a good resource to demonstrate the many facets of advance assembly of lead-free solders and can serve as a very informative technical reference. Valuable as a learning tool of semiconductor packaging and assembly reliability, its clear relevance to real-world industry practices make it useful for both academics and semiconductor industry practitioners." (Chong Leong Gan and Hem Takiar, Life Cycle Reliability and Safety Engineering, July 31, 2020)