Industrial Applications of Adhesives
1st International Conference on Industrial Applications of Adhesives
(Sprache: Englisch)
This book gathers selected papers presented at the 1st International Conference on Industrial Applications of Adhesives 2020 (IAA 2020). It covers a wide range of topics, including adhesive curing for electronic and automotive industries; adhesive testing...
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Klappentext zu „Industrial Applications of Adhesives “
This book gathers selected papers presented at the 1st International Conference on Industrial Applications of Adhesives 2020 (IAA 2020). It covers a wide range of topics, including adhesive curing for electronic and automotive industries; adhesive testing with a torsion machine for rigorous mechanical properties determination; joint design using innovative techniques such as the meshless method; design methodologies in the automotive industry for joints under impact; temperature effects in joints typically found in civil engineering; and advanced nondestructive techniques such as terahertz spectroscopy to assess the durability of adhesive joints. Providing a review of the state-of the art in industrial applications of adhesives, the book serves as a valuable reference resource for researchers and graduate students interested in adhesive bonding.Inhaltsverzeichnis zu „Industrial Applications of Adhesives “
Novel torsion machine to test adhesive joints.- Ageing condition determination of bonded joints by terahertz spectroscopy.- Analysis of Temperature Effect on Deformation Behaviour and Bond Strength of Adhesive Joints with Steel and Composite Substrates.- Some Industrial Examples of Accelerated Curing Using Curie Particles.- Use of UV-curing adhesive systems on non-transparent joining parts by using sidelight activated polymer optical fibres.- Techniques for the mechanical characterization and numerical modelling of bonded automotive structures under impact loads.
Bibliographische Angaben
- 2021, 1st ed. 2021, VII, 138 Seiten, 67 farbige Abbildungen, Maße: 15,5 x 23,5 cm, Kartoniert (TB), Englisch
- Herausgegeben: Lucas F. M. da Silva, Robert D. Adams, Chiaki Sato, Klaus Dilger
- Verlag: Springer, Berlin
- ISBN-10: 9811567697
- ISBN-13: 9789811567698
Sprache:
Englisch
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