Mechanical Microsensors
(Sprache: Englisch)
This book provides a comprehensive description of microsensors for mechanical quantities (flow, pressure, force, inertia) fabricated by silicon micromachining. Since the design of such sensors requires interdisciplinary teamwork, the presentation is made...
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This book provides a comprehensive description of microsensors for mechanical quantities (flow, pressure, force, inertia) fabricated by silicon micromachining. Since the design of such sensors requires interdisciplinary teamwork, the presentation is made accessible to engineers trained in electrical and mechanical engineering, physics and chemistry. The reader is guided through the micromachining fabrication process. A chapter on microsensor packaging completes the discussion of technological problems. The description of the basic physics required for sensor design includes the mechanics of deformation and the piezoresistive transduction to electrical signals. There is also a comprehensive discussion of resonant sensors, the hydrodynamics and heat transfer relevant for flow sensors, and, finally, electronic interfacing and readout circuitry. Numerous up-to-date case studies are presented, together with the working, fabrication and design of the sensors.
Klappentext zu „Mechanical Microsensors “
This book on mechanical microsensors is based on a course organized by the Swiss Foundation for Research in Microtechnology (FSRM) in Neuchatel, Swit zerland, and developed and taught by the authors. Support by FSRM is herewith gratefully acknowledged. This book attempts to serve two purposes. First it gives an overview on me chanical microsensors (sensors for pressure, force, acceleration, angular rate and fluid flow, realized by silicon micromachining). Second, it serves as a textbook for engineers to give them a comprehensive introduction on the basic design issues of these sensors. Engineers active in sensor design are usually educated either in electrical engineering or mechanical engineering. These classical educa tional pro grams do not prepare the engineer for the challenging task of sensor design since sensors are instruments typically bridging the disciplines: one needs a rather deep understanding of both mechanics and electronics. Accordingly, the book contains discussion of the basic engineering sciences relevant to mechanical sensors, hopefully in a way that it is accessible for all colours of engineers. Engi rd th neering students in their 3 or 4 year should have enough knowledge to be able to follow the arguments presented in this book. In this sense, this book should be useful as textbook for students in courses on mechanical microsensors (as is CUf rently being done at the University ofTwente).
Inhaltsverzeichnis zu „Mechanical Microsensors “
1. Introduction.- 2. MEMS.- 2.1 Miniaturisation and Systems.- 2.2 Examples for MEMS.- 2.3 Small and Large: Scaling.- 2.4 Available Fabrication Technology.- 3. Introduction into Silicon Micromachining.- 3.1 Photolithography.- 3.2 Thin Film Deposition and Doping.- 3.3 Wet Chemical Etching.- 3.4 Waferbonding.- 3.5 Plasma Etching.- 3.6 Surface Micromachining.- 4. Mechanics of Membranes and Beams.- 4.1 Dynamics of the Mass Spring System.- 4.2 Strings.- 4.3 Beams.- 4.4 Diaphragms and Membranes.- 5. Principles of Measuring Mechanical Quantities: Transduction of Deformation.- 5.1 Metal Strain Gauges.- 5.2 Semiconductor Strain Gauges.- 5.3 Capacitive Transducers.- 6. Force and Pressure Sensors.- 6.1 Force Sensors.- 6.1.1 Load Cells.- 6.2 Pressure Sensors.- 7. Acceleration and Angular Rate Sensors.- 7.1 Acceleration Sensors.- 7.2 Angular Rate Sensors.- 8. Flow sensors.- 8.1 The Laminar Boundary Layer.- 8.2 Heat Transport in the Limit of Very Small Reynolds Numbers.- 8.3 Thermal Flow Sensors.- 8.4 Skin Friction Sensors.- 8.5 "Dry Fluid Flow" Sensors.- 8.6 "Wet Fluid Flow" Sensors.- 9. Resonant Sensors.- 9.1 Basic Principles and Physics.- 9.2 Excitation and Detection Mechanisms.- 9.3 Examples and Applications.- 10. Electronic Interfacing.- 10.1 Piezoresistive Sensors.- 10.2 Capacitive Sensors.- 10.3 Resonant Sensors.- 11. Packaging.- 11.1 Packaging Techniques.- 11.2 Stress Reduction.- 11.3 Pressure Sensors.- 11.4 Inertial Sensors.- 11.5 Thermal Flow Sensors.- References.
Bibliographische Angaben
- Autoren: M. Elwenspoek , R. Wiegerink
- 2010, X, 295 Seiten, Maße: 15,5 x 23,7 cm, Kartoniert (TB), Englisch
- Verlag: Springer, Berlin
- ISBN-10: 364208706X
- ISBN-13: 9783642087066
Sprache:
Englisch
Pressezitat
"Mechanical Microsensors provides a comprehensive description of the various design techniques required for silicon micromachining of sensors. This is a very well written book which has a pleasant balance of mathematical, physics and engineering principles, that make this book suitable for physicists, chemistry, electrical and mechanical engineers." --SENSOR REVIEW
"Of particular value is the fact that the authors go further than the description of the silicon sensor elements and also present solutions on how to interface these sensors to the surrounding world - electronically in the chapter on 'Electronic Interfacing' as well as physically in the chapter on 'Packaging'. To summarize, this textbook gives a comprehensive overview of mechanical microsensors which is especially well suited for students in courses on mechanical microsensors, but is also valuable for people in research and industry with an interest in this exciting and growing field."
-MEASUREMENT SCIENCE AND TECHNOLOGY
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