Process Variations and Probabilistic Integrated Circuit Design
(Sprache: Englisch)
Based on qualitative and quantitative insight, this volume presents the technological, physical, and mathematical fundamentals for a design paradigm shift for microelectronic circuits. The text explores design flow variations to establish different variants while optimizing the overall design.
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Based on qualitative and quantitative insight, this volume presents the technological, physical, and mathematical fundamentals for a design paradigm shift for microelectronic circuits. The text explores design flow variations to establish different variants while optimizing the overall design.
Klappentext zu „Process Variations and Probabilistic Integrated Circuit Design “
Uncertainty in key parameters within a chip and between different chips in the deep sub micron area plays a more and more important role. As a result, manufacturing process spreads need to be considered during the design process. Quantitative methodology is needed to ensure faultless functionality, despite existing process variations within given bounds, during product development.This book presents the technological, physical, and mathematical fundamentals for a design paradigm shift, from a deterministic process to a probability-orientated design process for microelectronic circuits. Readers will learn to evaluate the different sources of variations in the design flow in order to establish different design variants, while applying appropriate methods and tools to evaluate and optimize their design.
Inhaltsverzeichnis zu „Process Variations and Probabilistic Integrated Circuit Design “
Introduction.- Physical and Mathematical Fundamentals.- Examination of Process Parameter Variations.- Methods of Parameter Variations.- Consequences for Circuits Design and Case Studies.- Conclusion.Autoren-Porträt
Dr. Manfred Dietrich leitet die Abteilung Mikroelektronische Systeme am Fraunhofer Institut, Institutsteil Entwurfsautomatisierung, in Dresden. Seit Jahren ist diese Abteilung in verschiedenen Industrie- und Förderprojekten auf dem Gebiet des 3D-Entwurfs integriert; sie arbeitet also aktiv an vorderster Stelle auf diesem neuen Arbeitsfeld mit.
Bibliographische Angaben
- 2012, 2012, XVI, 252 Seiten, Maße: 15,5 x 23,5 cm, Kartoniert (TB), Englisch
- Herausgegeben: Manfred Dietrich, Joachim Haase
- Verlag: Springer, Berlin
- ISBN-10: 1489988602
- ISBN-13: 9781489988607
Sprache:
Englisch
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