RF and Microwave Microelectronics Packaging
(Sprache: Englisch)
This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.
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Produktinformationen zu „RF and Microwave Microelectronics Packaging “
This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.
Klappentext zu „RF and Microwave Microelectronics Packaging “
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Inhaltsverzeichnis zu „RF and Microwave Microelectronics Packaging “
- Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages
- Polymeric Microelectromechanical Millimeter Wave Systems
- Millimeter-Wave Chip-on-Board Integration and Packaging
- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules
- RF/Microwave Substrate Packaging Roadmap for Portable Devices
- Ceramic Systems in Package for RF and Microwave
- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications
- LTCC Substrates for RF/MW Application
- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging
- High Performance Microelectronics Packaging Heat Sink Materials
- Technology Research on AlN 3D MCM
Bibliographische Angaben
- 2014, 2010, XVI, 285 Seiten, Maße: 15,5 x 23,5 cm, Kartoniert (TB), Englisch
- Herausgegeben: Ken Kuang, Franklin Kim, Sean S. Cahill
- Verlag: Springer, Berlin
- ISBN-10: 1489983244
- ISBN-13: 9781489983244
Sprache:
Englisch
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