Human-in-the-Loop (PDF)
Probabilistic Modeling of an Aerospace Mission Outcome
(Sprache: Englisch)
This book covers probabilistic predictive modeling in human-in-the-loop situations in aerospace engineering. Situations when human performance and equipment reliability contribute jointly to the success and safety of an aerospace mission. This new approach...
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This book covers probabilistic predictive modeling in human-in-the-loop situations in aerospace engineering. Situations when human performance and equipment reliability contribute jointly to the success and safety of an aerospace mission. This new approach can be adapted across other disciplines as well.
Autoren-Porträt von Ephraim Suhir
Dr. E. Suhir is on the faculty of the Portland State University, Portland, OR, USA, and Vienna Institute of Technology, Vienna, Austria. He is Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics Packaging Society (IMAPS); Fellow the Institute of Physics, UK; and the Society of Plastics Engineers (SPE). Ephraim holds 22 US patents and has authored and co-authored above 400 technical publications (papers, book chapters, books, and peer-reviewed conference proceedings), presented numerous keynote and invited talks worldwide, and received many professional awards. Also by Ephraim SuhirStructural Analysis in Microelectronic and Fiber Optic Systems: Basic Principles of Engineering Elasticity and Fundamentals of Structural Analysis, Van Nostrand Reinhold, New York, 1991
Applied Probability for Engineers and Scientists, McGraw Hill, New York, 1997.
Dynamic Response of Microelectronic Systems to Shocks and Vibrations, John Wiley, New York, 2011 (co-edited with D. Steinberg, and T. Yi)
Reliability of Photonic Materials and Structures, MRS Symposia Proceedings, vol. 531, 1998 (co-edited with M. Fukuda and C. R. Kurkjian) .
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability, 2 volumes, Springer, 2008 (co-edited with CP Wong and YC Lee)
Bibliographische Angaben
- Autor: Ephraim Suhir
- 2018, 1. Auflage, 237 Seiten, Englisch
- Verlag: Taylor & Francis
- ISBN-10: 1351132504
- ISBN-13: 9781351132503
- Erscheinungsdatum: 28.03.2018
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- Größe: 5.48 MB
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Englisch
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