Modern Approaches to Discrete, Integrated Component and System Reliability Engineering (ePub)
Reliability Engineering
(Sprache: Englisch)
This book covers the, methodology and processes required for a successful new product system, component and device development reliability.
This book covers introductory definition of reliability terms and gradually build reliability and develop models...
This book covers introductory definition of reliability terms and gradually build reliability and develop models...
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This book covers the, methodology and processes required for a successful new product system, component and device development reliability.
This book covers introductory definition of reliability terms and gradually build reliability and develop models from components, systems, software reliability and show case study examples of how these methodologies are used was illustrated.
This book is the outgrowth of my over 22 years of professional engineering experience in semiconductor industry and systems. This book unlike any other textbook on the subject, presents the processes of reliability engineering conceptually, and with minute details to encourage understanding and assimilation of the material and to show how the concept of reliability is translated from mathematical probability to full product reliability testing.
This book bridges the gaps of reliability introduced by the rapid semiconductor advances, process miniaturization, new package and material advances and attempts to shorten new product development, and manufacturing release cycles.
This book covers introductory definition of reliability terms and gradually build reliability and develop models from components, systems, software reliability and show case study examples of how these methodologies are used was illustrated.
This book is the outgrowth of my over 22 years of professional engineering experience in semiconductor industry and systems. This book unlike any other textbook on the subject, presents the processes of reliability engineering conceptually, and with minute details to encourage understanding and assimilation of the material and to show how the concept of reliability is translated from mathematical probability to full product reliability testing.
This book bridges the gaps of reliability introduced by the rapid semiconductor advances, process miniaturization, new package and material advances and attempts to shorten new product development, and manufacturing release cycles.
Autoren-Porträt von John Jay
The author is Registered Professional Engineer in Electrical Engineering for over 18years with State of California, author has Bachelor's degree in Electrical Engineers, Master's degree in Information Technology, has completed some Doctoral working on Dissertation.The author has over 22 years of professional engineering experience in semiconductor industry, systems and medical devices. The author has worked at over six different companies, including Signetics, National Semiconductor, Fujitsu Microelectronics, GE Healthcare, Intel corporation, Cisco Systems, Accuray Systems and has been responsible for over 20 different new products, systems and medical devices and worked with over 30 different semiconductor processes, assembly, over six different semiconductor foundry many PWB vendors, assembly and test houses.
This book is the outgrowth of the authors over 22 years of industrial and professional experience and serves as the authors contribution to Engineering and professional body of knowledge and benefit to mankind quality of life
Bibliographische Angaben
- Autor: John Jay
- 2016, 134 Seiten, Englisch
- Verlag: Xlibris US
- ISBN-10: 1514451360
- ISBN-13: 9781514451366
- Erscheinungsdatum: 02.02.2016
Abhängig von Bildschirmgröße und eingestellter Schriftgröße kann die Seitenzahl auf Ihrem Lesegerät variieren.
eBook Informationen
- Dateiformat: ePub
- Größe: 3.85 MB
- Mit Kopierschutz
Sprache:
Englisch
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