Solder Joint Technology / Springer Series in Materials Science Bd.92 (PDF)

Name: Solder Joint Technology / Springer Series in Materials Science Bd.92
Brand: Springer-Verlag GmbH
SKU: 29550969
Price: 229.90 EUR
Availability: OnlineOnly

Materials, Properties, and Reliability (Sprache: Englisch)

Autor: King-Ning Tu

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Solder Joint Technology / Springer Series in Materials Science Bd.92, King-Ning Tu

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The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.

Inhaltsverzeichnis zu „Solder Joint Technology / Springer Series in Materials Science Bd.92 (PDF)“

Introduction.- Cu-Sn reaction in bulk samples.- Cu-Sn reaction in thin film samples. Cu-Sn reaction in flip chip solder joints and electromigration.- Kinetic analysis of flux-driven ripening of Cu-Sn scallops.- Polarity effect of electromigration on solder reactions.- Ductile-to-brittle transition of solder joints affected by Cu-Sn reactions.- Spontaneous Sn whisker growth on Cu leadframe finished with Pb-free.- Comparison to solder reactions on other metals.