Advancement of Optical Methods in Experimental Mechanics

1 A General Mathematical Model to Retrieve Displacement Information from Fringe Patterns.- 2 Full-Field High-Strain Evaluation from Wrapped ESPI Data Using Phasors.- 3 Dynamic Deformation with Static Load.- 4 Full-field Digital Holographic Vibrometry for Characterization of High-speed MEMS.- 5 DD DIC A Parallel Finite Element Based Digital Image Correlation Solver.- 6 Thermal Strain Measurement Using Digital Image Correlation with Systematic Error Elimination.- 7 Investigating the Tensile Response of Materials at High Temperature Using DIC.- 8 Hybrid Stereocorrelation for 3D Thermomechanical Field Measurements.- 9 Experimental Characterization of the Mechanical Properties of 3D Printed ABS and Polycarbonate Parts.- 10 Experimental Determination of Transfer Length in Pre-Stressed Concrete Using 3D-DIC.- 11 Hybrid Infrared Image Correlation Technique to Deformation Measurement of Composites.- 12 DIC Anisotropic Denoising Based onUncertainty.- 13 An Applications-Oriented Measurement System Analysis of 3D Digital Image Correlation.- 14 Preliminary study on Determination Pointing-Knowledge of Camera-Pair Used for 3D DIC.- 15 Elimination of Periodical Error for Bi-directional Displacement in Digital Image Correlation Method.- 16 The Cluster Approach Applied to Multi-Camera 3D DIC system.- 17 Self-Adaptive Isogeometric Global Digital Image Correlation and Digital Height Correlation.- 18 Ultrasonic Test for High Rate Material Property Imaging.- 19 Analysis of Dynamic Bending Using DIC and Virtual Fields Method.- 20 The Virtual Fields Method to Rubbers Under Medium Strain Rates.- 21 Inertial Impact Tests on Polymers for Inverse Parameter Identification.- 22 Full-field Identification Methods: Comparison of FEM Updating and Integrated DIC.- 23 Finite Element Stereo Digital Image Correlation Measure for Plate Model.- 24 Opportunities for Inverse Analysis in Dynamic Tensile Testing.- 25 Determination of the Dynamic Strain Hardening Parameters From Acceleration Fields.- 26

Prof. Sanichiro Yoshida-Southeastern Louisiana University, USA; Prof. Luciano Lamberti -Politecnico di Bari, Italy; Prof. Cesar A. Sciammarella - Illinois Institute of Technology, USA