Heterogeneous Integrations
(Sprache: Englisch)
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and...
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Klappentext zu „Heterogeneous Integrations “
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Inhaltsverzeichnis zu „Heterogeneous Integrations “
Chapter 1. Overview of 3D IC Heterogeneous Integrations.- Chapter 2. RDLs for Heterogeneous Integrations on Organic Substrates.- Chapter 3. RDLs for Heterogeneous Integration on Silicon (TSV-Interposers).- Chapter 4. RDLs for Heterogeneous Integration on Silicon (Bridges).- Chapter 5. RDLs for Heterogeneous Integration on Fan-Out Substrates.- Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking.- Chapter 7. 3D IC Heterogeneous Integration in PoP Formats.- Chapter 8. 3D IC Heterogeneous Integration in Chip-to-Chip Formats.- Chapter 9. 3D IC Heterogeneous Integration with LED and VCSEL.- Chapter 10. Future Trends of 3D IC Heterogeneous Integrations.
Autoren-Porträt von John H. Lau
SPECIALIZED PROFESSIONAL COMPETENCE Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. SMT, fan-out and fan-in WLP, TSV, 3D IC Integration, heterogeneous integration and SiP. Leadfree soldering, manufacturing, and solder joint reliability. Management of a R&D Laboratory and Company.
BACKGROUND AND PROFESSIONAL EXPERIENCE
Ph.D. (Theoretical and Applied Mechanics), University of Illinois, Urbana, IL (1977)M.S. (Engineering Physics), University of Wisconsin, Madison, WI (1974)
Bibliographische Angaben
- Autor: John H. Lau
- 2019, 1st ed. 2019, XXII, 368 Seiten, 342 farbige Abbildungen, Maße: 16,1 x 23,9 cm, Gebunden, Englisch
- Verlag: Springer, Berlin
- ISBN-10: 9811372233
- ISBN-13: 9789811372230
Sprache:
Englisch
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