Plasma-Surface Interactions and Processing of Materials

Basic Physics of Plasmas/Discharges: Production of Active Species.- Plasma Chemistry in Etching.- Optical Diagnostic Techniques for Low Pressure Plasma Processing.- Measuring Eedf in Gas Discharge Plasmas.- Transport Phenomena in Plasma Processing.- Kinetics of a Low-Pressure H2 Multipole Discharge Used for GaAs Treatment.- Ar and Ti Excited States in the Vicinity of the Substrate during Magnetron Sputtering of Ti.- Modeling of the Plasma Nitriding Process.- Plasma Measurements in a Magnetron Sputtering Device.- Laser Induced Fluorescence Measurements of Ion Distribution Functions.- Laser Induced Fluorescence Measurements in Plasma Etching Processes.- Effect of Modulation on the Plasma Deposition of Hydrogenated and Fluorinated Silicon Nitride.- Partial Pressure Analysis of CF4/O2 Plasmas.- Surface Characterization of Corona Discharge Treated Poly (Ethylene Terephthalate).- The Physics of the Sputter Erosion Process.- Basic Phenomena in Reactive Etching of Materials.- Particle Bombardment Effects in thin Film Deposition.- Low-Energy Ion/Surface Interactions during Film Growth from the Vapor Phase: Effects on Nucleation and Growth Kinetics, Defect Structure, and Elemental Incorporation Probabilities.- Low-Energy Accelerated-Ion Doping of Si During Molecular Beam Epitaxy: Incorporation Probabilities, Depth Distribution, and Electrical Properties.- In Situ Substrate Chemical Analysis during Sputter Deposition.- Reactive Ion Beam Etching Studies of Tungsten with CF4 Using Ion Scattering Spectroscopy.- Estimation of Structural Damage Induced by Technological Processes on the Surface of Crystalline Binary Compounds by X-Ray Photoelectron Diffraction: Application to Reactive Ion Etching of GaAs(001) Surfaces.- In-Situ XPS Studies of thin Silicon Nitride Films on III-V Semiconductors Produced by Remote Plasma Enhanced Chemical Vapour Deposition.- Compositional and Structural Analysis of RF Sputtered Hydrogenated Amorphous Si1-xGex Alloys.- Thin Film Inhomogeneity