Power Distribution Networks in High Speed Integrated Circuits

1. Introduction.- 1.1 Evolution of integrated circuit technology.- 1.2 Evolution of design objectives.- 1.3 The problem of power distribution.- 1.4 Deleterious effects of power distribution noise.- 1.5 Book outline.- 2. Inductive Properties of Electric Circuits.- 2.1 Definitions of inductance.- 2.2 Variation of inductance with frequency.- 2.3 Inductive behavior of circuits.- 2.4 Inductive properties of on-chip interconnect.- 2.5 Summary.- 3. Properties of On-Chip Inductive Current Loops.- 3.1 Introduction.- 3.2 Dependence of inductance on line length.- 3.3 Inductive coupling between two parallel loop segments.- 3.4 Application to circuit analysis.- 3.5 Summary.- 4. Electromigration.- 4.1 Physical mechanism of electromigration.- 4.2 Electromigration-induced mechanical stress.- 4.3 Steady state limit of electromigration damage.- 4.4 Dependence of electromigration lifetime on the line dimensions.- 4.5 Statistical distribution of electromigration lifetime.- 4.6 Electromigration lifetime under AC current.- 4.7 Electromigration in novel interconnect technologies.- 4.8 Designing for electromigration reliability.- 4.9 Summary.- 5. High Performance Power Distribution Systems.- 5.1 Physical structure of a power distribution system.- 5.2 Circuit model of a power distribution system.- 5.3 Output impedance of a power distribution system.- 5.4 A power distribution system with a decoupling capacitor.- 5.5 Hierarchical placement of decoupling capacitance.- 5.6 Resonance in power distribution networks.- 5.7 Full impedance compensation.- 5.8 Case study.- 5.9 Design considerations.- 5.10 Limitations of the one-dimensional circuit model.- 5.11 Summary.- 6. On-Chip Power Distribution Networks.- 6.1 Styles of on-chip power distribution networks.- 6.2 Allocation of on-chip decoupling capacitance.- 6.3 Die-package interface.- 6.4 Other considerations.- 6.5 Summary.- 7. Computer-Aided Design and Analysis.- 7.1 Design flow for on-chip power distribution networks.- 7.2 Linear analysis of

Professor Dr. Eby Friedman, Department of Electrical & Computer Engineering, University of Rochester, Rochester, New York 14627-0231, USA.

From the reviews:



"This authoritative and interesting book concentrates on explanation of behavior and design of power distribution systems for high-speed and high-complex ICs. ... It is a nice introductory text on basic principles that govern the design and operation of on-chip power distribution networks. This book is timely, and very well written. Its style is clear and readable. It should make an important reference book ... . an excellent work and should be read by many of us. It is ... an instructive and informative well-written book." (Mile Stojcev, Microelectronics Reliability, Vol. 44, 2004)