Security and Privacy in Cyber-Physical Systems and Smart Vehicles
First EAI International Conference, SmartSP 2023, Chicago, USA, October 12-13, 2023, Proceedings
(Sprache: Englisch)
This book constitutes the refereed proceedings of the First EAI International Conference, SmartSP 2023, held in Chicago, USA, during October 12-13, 2023.
The 11 revised full papers were carefully reviewed and selected from 24 submissions. The...
The 11 revised full papers were carefully reviewed and selected from 24 submissions. The...
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Produktinformationen zu „Security and Privacy in Cyber-Physical Systems and Smart Vehicles “
Klappentext zu „Security and Privacy in Cyber-Physical Systems and Smart Vehicles “
This book constitutes the refereed proceedings of the First EAI International Conference, SmartSP 2023, held in Chicago, USA, during October 12-13, 2023.The 11 revised full papers were carefully reviewed and selected from 24 submissions. The papers focus on all details all technological aspects that are relevant to Security and privacy in cyber-physical systems.
Inhaltsverzeichnis zu „Security and Privacy in Cyber-Physical Systems and Smart Vehicles “
Exploring Vulnerabilities in Voice Command Skills for Connected Vehicles.- Enabling Real-Time Restoration of Compromised ECU Firmware in Connected and Autonomous Vehicles.- mmFingerprint: A New Application Fingerprinting.- Technique via mmWave Sensing and Its Use in Rowhammer Detection.- ADC-Bank: Detecting Acoustic Out-of-Band Signal.- Injection on Inertial Sensors.- An E icient and Smooth Path Planner Based on Hybrid Embracing Semi-Supervised Domain Adaptation for Federated Knowledge Transfer.- A Lightweight Reputation System for UAV Networks.- Resilient Range-only Cooperative Positioning of Multiple Smart Unmanned Aerial Systems.- Securing the Future: Exploring Privacy Risks and Security.- Questions in Robotic Systems.- Waves of Knowledge: A Comparative Study of Electromagnetic and Power Side-Channel Monitoring in Embedded Systems.
Bibliographische Angaben
- 2024, 1st ed. 2024, XII, 172 Seiten, 48 farbige Abbildungen, Maße: 15,5 x 23,5 cm, Kartoniert (TB), Englisch
- Herausgegeben: Yu Chen, Chung-Wei Lin, Bo Chen, Qi Zhu
- Verlag: Springer, Berlin
- ISBN-10: 303151629X
- ISBN-13: 9783031516290
Sprache:
Englisch
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