Proceedings of the 4th International Symposium on Plasma and Energy Conversion / Springer Proceedings in Physics Bd.391 (PDF)

Dong Dai received the B.Sc. degree and Ph.D. degree in electrical engineering from Xi'an Jiaotong University, Xi'an, China, respectively, in 1998 and 2003. From 2003 to 2005, he worked in the Department of Electronic and Information Engineering, Hong Kong Polytechnic University, as a research associate. From 2005 to 2009, he became an associate professor at the School of Electrical Engineering, Xi'an Jiaotong University. In 2009, he moved to the School of Electric Power, South China University of Technology, Guangzhou, China, as an associate professor. Since 2013, he has been a professor with the same university. His current research interests include fundamental theory on gas discharge and low-temperature plasmas, scientific computation integrating physics, and data in engineering and science.



Cheng Zhang received the Ph.D. degree in electrical engineering from the University of Chinese Academy of Sciences, Beijing, China, in 2011. Since 2011, he has been with the Institute of Electrical Engineering, Chinese Academy of Sciences, where he became a professor in 2022. From 2015 to 2016, he was a visiting scholar with the NonEquilibrium Thermodynamics Laboratory, Department of Mechanical and Aerospace Engineering, Ohio State University, Columbus, OH, USA. His current research interests include gas discharge and non-thermal applications. He is the IET fellow, an IEEE senior member, and a member of the IEEE Nuclear and Plasma Sciences Society and the Dielectrics and Electrical Insulation Society of IEEE.

Zhi Fang received the B.S., M.S., and Ph.D. degrees in electrical engineering from Xi'an Jiaotong University, Xi'an, China, in 1999, 2002, and 2005, respectively. He is currently a professor at Nanjing Tech University, Nanjing, China. His current research interests include atmospheric pressure gas discharge plasmas, high-voltage insulation, and the applications of atmospheric pressure plasma for materials surface processing. He is amember of